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  1. Inorganic chemistry meets stencil cleaning challenge.

    Article - En anglais

    A clean stencil is a key factor in the application of proper amounts of solder paste in surface mount technology.

    An aqueous, inorganic-based stencil cleaner that will meet performance, environmental and worker safety needs is developed.

    The cleaner is a blend of inorganic salts and surfactants.

    It is solventless and poses no ozone-depletion, volatile organic compound or biological/chemical oxygen demand potential.

    It is also odorless and features low surface tension.

    Results of laboratory performance tests and subsequent stencil-cleaning tests using commercial cleaning equipment demonstrate that the inorganic-based aqueous cleaning agent is effective for solder paste removal and has specific advantages over IPA.

    Mots-clés Pascal : Article synthèse, Composé organique volatil, DBO, Impact environnement, Facteur sécurité, Prévention accident, Sel, Agent surface, Nettoyage chimique, Brasage tendre, Composant monté surface

    Mots-clés Pascal anglais : Stencil cleaning, Solder paste, Reviews, Volatile organic compounds, Biochemical oxygen demand, Environmental impact, Safety factor, Accident prevention, Salts, Surface active agents, Chemical cleaning, Soldering, Surface mount technology

    Logo du centre Notice produite par :
    Inist-CNRS - Institut de l'Information Scientifique et Technique

    Cote : 96-0148794

    Code Inist : 001D03F. Création : 199608.