A clean stencil is a key factor in the application of proper amounts of solder paste in surface mount technology.
An aqueous, inorganic-based stencil cleaner that will meet performance, environmental and worker safety needs is developed.
The cleaner is a blend of inorganic salts and surfactants.
It is solventless and poses no ozone-depletion, volatile organic compound or biological/chemical oxygen demand potential.
It is also odorless and features low surface tension.
Results of laboratory performance tests and subsequent stencil-cleaning tests using commercial cleaning equipment demonstrate that the inorganic-based aqueous cleaning agent is effective for solder paste removal and has specific advantages over IPA.
Mots-clés Pascal : Article synthèse, Composé organique volatil, DBO, Impact environnement, Facteur sécurité, Prévention accident, Sel, Agent surface, Nettoyage chimique, Brasage tendre, Composant monté surface
Mots-clés Pascal anglais : Stencil cleaning, Solder paste, Reviews, Volatile organic compounds, Biochemical oxygen demand, Environmental impact, Safety factor, Accident prevention, Salts, Surface active agents, Chemical cleaning, Soldering, Surface mount technology
Notice produite par :
Inist-CNRS - Institut de l'Information Scientifique et Technique
Cote : 96-0148794
Code Inist : 001D03F. Création : 199608.